Engineers Create Tiny Wires WIth Old Technique 27
Gamp writes with this interesting snippet: "As microprocessors have shrunk, the wiring between them hasn't always kept up. But engineers at the University of Illinois are changing that with a decades-old metalworking technique. It's called electrodeposition. It's basically the same process used in electroplating, but instead of depositing metal on a surface, as when trying to make a gold-plated piece of jewelry, the metal is deposited in a wire. 'People weren't thinking about how to fabricate a wire in three dimensional space,' said Min-Feng Yu, a professor of mechanical science and engineering."
Re:link to (unfortunately, paywalled) paper (Score:1, Funny)
Anyway, it's this:
Jie Hu and Min-Feng Yu (2010). Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds [sciencemag.org]. Science 329(5989): 313-316.
about as readable as the Sunday Times website
Re:transistor density (Score:2, Funny)
Oh IC now.
Re:Thin copper wire (Score:3, Funny)
With two lawyers, you would get a wire.
With two politicians, you get a missing penny.