ScuttleMonkey writes: "A joint venture between Intel and Micron has given rise to a new 128Gb die. While production wont start until next year and distribution mostly likely not until 2013, this little beauty sets new bars for capacity, speed, and endurance. "Die shrinks also tend to reduce endurance, with old 65 m MLC flash being rated at 5,000-10,000 erase cycles, but that number dropping to 3,000-5,000 for 25nm MLC flash. However, IMFT is claiming that the shrink to 20nm has not caused any corresponding reduction in endurance. Its 20nm flash uses a Hi-K/metal gate design which allows it to make transistors that are smaller but no less robust. IMFT is claiming that this use of Hi-K/metal gate is a first for NAND flash production.""