Four years after introducing its MicroLED technology at CES 2018, Samsung claims the technology is ready for the masses and "will set the standard for picture quality in 2023," reports Engadget. From the report: At CES 2023, the company announced it would offer 50-, 63-, 76-, 89-, 101-, 114- and 140-inch MicroLED models, greatly expanding the amount of choice consumers have when it comes to the new display technology. Samsung didn't provide pricing and availability information for the expanded line, but the company claims the new models are its most affordable MicroLED TVs to date. [...] The set sports a 240Hz variable refresh rate and 2-nanosecond response time. It also offers 20-bit black detail for "intense" contrast.

Samsung is also promising upgrades for its Neo QLED sets, starting with the line's new flagship. The QN900C features an 8K Quantum MiniLED-lit panel capable of maxing out at 4,000 nits of brightness. As with Samsung's 2022 Neo QLED sets, the QN900C features a 14-bit backlight. However, the TV offers even better contrast thanks to a tweak the company made to its 8K Real Depth Enhancer Pro software. Samsung is also promising improved picture quality when viewing older movies and TV shows thanks to the inclusion of its new Auto HDR Remastering algorithm, which can automatically apply HDR effects to standard dynamic range content.

For those who would prefer a 4K set, there's also the QN935C. Samsung's new 4K flagship features a redesigned power board that eliminates the need for an external connection box and allows for bezels that are less than 20mm thick. The QN935C also features top-firing speakers, allowing the set to produce Dolby Atmos sound without a dedicated soundbar. You can use both the QN900C and QN935C as a smart home hub thanks to the fact Samsung's entire 2023 Neo QLED line will feature built-in Zigbee and Matter Thread all-in-one modules. As for its OLED models, Samsung announced the 2023 QD-OLED TV line, which will offer up to 2,000 nits of peak brightness and support 144Hz refresh rates -- all while being more energy efficient than before. "Additionally, the company has gone out of its way to get the panels AMD FreeSync Premium Pro certified," adds Engadget.

The PS5 looks to have a design fault that can take months to appear and only seems to happen if you use the console while it's in a vertical orientation. From a report: As Wololo reports, hardware repair specialists working on PS5 consoles that fail to boot are finding the problem is caused by the liquid metal thermal interface Sony used on the custom AMD Zen 2 CPU. When the PS5 is oriented in a vertical position, over time the liquid metal is moving and spilling out on to the components surrounding the CPU. This also means the liquid metal is no longer evenly spread across the chip it's meant to help cool.

At CES this week, AMD announced a suite of new chips for notebooks and desktop computers, with one notable announcement being the company's new AMD Ryzen 7040 series of processors for ultrathin notebooks that will compete with Apple's M1 Pro and M2 chips. MacRumors reports: The AMD Ryzen 7040 series of chips are "ultrathin" processors based on the 4nm process, and the highest-end chip part of the family is the Ryzen 9 7940HS. The Ryzen 9 7940HS has eight cores, 16 threads, and 5.2GHz boost speeds. Announcing the new chip, AMD CEO Lisa Su made bold claims about its performance, saying it's up to 30% faster than Apple's M1 Pro chip. In specific tasks, AMD claims the chip is 34% faster in multiprocessing workloads than the M1 Pro and 20% faster than the M2 in AI tasks.

One cornerstone of Apple silicon is energy efficiency, and in that area, AMD claims the new AMD Ryzen 7040 series will offer 30+ hours of video playback in ultrathin notebooks. Built directly into the series of chips is Ryzen AI, a dedicated AI engine embedded in the processor. AMD chips configured with Ryzen AI are 20% faster in AI tasks than Apple's M2 chip while being 50% more energy efficient, according to the company.

To showcase the new chip's performance, AMD compared the performance of a high-end Intel chip, the M1 Pro, and its new Ryzen 9 7940HS processor rendering an object in the popular application Blender. In the time-lapsed video shown on stage, the M1 Pro lags behind the Ryzen 9 7940HS in rendering the object. AMD says it made its performance claims against a MacBook Pro with M1 Pro, 32GB of unified memory, and 1TB of SSD storage running macOS Monterey. The M1 Pro is not Apple's highest-end and most powerful chip for laptops, which is the M1 Max, and AMD did not compare its chip to the M1 Max. After roasting the M1 Pro, Ian Zelbo from FrontPageTech noticed AMD running their CES keynote on multiple 14-inch MacBook Pros. "Obviously these are contracted employees, and it means nothing," he tweeted. "I just always find stuff like this hilarious."

We do too... It's akin to the "Twitter for iPhone" line on tweets that have gotten Android promoters in hot water multiple times over the past several years.

Alienware is unveiling a refreshed lineup of its M- and X-series gaming laptops at CES 2023. Like some other laptop companies, including Razer and Acer, Alienware is shifting focus away from 15- and 17-inch laptops toward thin, powerful 16- and 18-inch models. From a report: The brand is going big with the new M18, an 18-inch model that's being pitched as a desktop replacement. This is actually a resurrection following the M18's previous spec update way back in 2015. The 2023 model will feature Intel's 13th Generation HX CPUs and Nvidia's RTX 4090 mobile graphics card. The latest processors and graphics options from AMD will be available in the M18 later in 2023. Not only is the M18 massive and powerful -- it's a big deal in other ways. It can be configured with an 18-inch QHD Plus screen in the taller 16:10 aspect ratio and set up to include a ton of ports, including two Thunderbolt 4 ports, HDMI 2.1, Ethernet, an SD card reader, and many others. It supports user-upgradeable dual DDR5 RAM slots, and you can also cram up to 9TB of NVMe M.2 storage in it. This model starts at $2,099, but the first configuration it's releasing will cost $2,899.

Demand for graphics cards significantly increased during the pandemic as some people spent more time at home playing games, whereas others tried to mine Ethereum to get some cash. But it looks like now that the world has re-opened and Ethereum mining on GPUs is dead, demand for desktop discrete GPUs has dropped dramatically. From a report: In fact, shipments of discrete graphics cards hit a ~20-year low in Q3 2022, according to data from Jon Peddie Research. The industry shipped around 6.9 million standalone graphics boards for desktop PCs -- including the best graphics cards for gaming -- and a similar number of discrete GPUs for notebooks in the third quarter.

In total, AMD, Intel, and Nvidia shipped around 14 million standalone graphics processors for desktops and laptops, down 42% year-over-year based on data from JPR. Meanwhile, shipments of integrated GPUs totaled around 61.5 million units in Q3 2022. In fact, 6.9 million desktop discrete add-in-boards (AIBs) is the lowest number of graphics cards shipped since at least Q3 2005 and, keeping in mind sales of standalone AIBs were strong in the early 2000s as integrated GPUs were not good enough back then, it is safe to say that in Q3 2022 shipments of desktop graphics boards hit at least a 20-year low.

HandBrake, the popular free and open source video transcoder, has been updated to version 1.6.0. This major point upgrade is notable for facilitating AV1 video encoding for the first time in a general release. Moreover, those with Intel Quick Sync Video (QSV) enabled processors, and those with Intel Arc GPUs will be able to encode AV1 video with hardware acceleration. From a report: HandBrake 1.6.0 can encode AV1 videos on any of its supported systems. In the current release its SVT-AV1 encoder offers the widest support, encoding on your processor through software. However, those with Intel QSV supporting CPUs or discrete Arc graphics can use the QSV-AV1 encoder for hardware accelerated processing. QSV isn't supported if your CPU is an 'F' suffixed model (i.e. it doesn't have an iGPU), or it is older than the Skylake generation. If you are lucky enough to have multiple QSV accelerators in your system, support for Intel Deep Link Hyper Encode should accelerate processing further. While AMD and Nvidia have AV1 encoders available for their latest GPUs, they currently aren't integrated with HandBrake. AV1 video is set to become the dominant codec across app-based streaming services and the wider internet, offering attractions such as; an open and royalty-free architecture, improved compression enabling efficient 8K video streaming, and support for the newest HDR standards.

The number of GPU startups in China is extraordinary as the country tries to gain AI prowess as well as semiconductor sovereignty, according to a new report from Jon Peddie Research. From a report: In addition, the number of GPU makers grew worldwide in recent years as demand for artificial intelligence (AI), high-performance computing (HPC), and graphics processing increased at a rather unprecedented rate. When it comes to discrete graphics for PCs, AMD and Nvidia maintain lead, whereas Intel is trying to catch up.

Tens of companies developed graphics cards and discrete graphics processors in the 1980s and the 1990s, but cut-throat competition for the highest performance in 3D games drove the vast majority of them out of business. By 2010, only AMD and Nvidia could offer competitive standalone GPUs for gaming and compute, whereas others focused either on integrated GPUs or GPU IP. The mid-2010s found the number of China-based PC GPU developers increasing rapidly, fueled by the country's push for tech self-sufficiency as well as the advent of AI and HPC as high-tech megatrends.

In total, there are 18 companies developing and producing GPUs, according to Jon Peddie Research. There are two companies that develop SoC-bound GPUs primarily with smartphones and notebooks in mind, there are six GPU IP providers, and there are 11 GPU developers focused on GPUs for PCs and datacenters, including AMD, Intel, and Nvidia, which design graphics cards that end up in our list of the best graphics cards. In fact, if we added other China-based companies like Biren Technology and Tianshu Zhixin to the list, there would be even more GPU designers. However, Biren and Tianshu Zhixin are solely focused on AI and HPC for now, so JPR does not consider them GPU developers.

An anonymous reader shares a report: While AMD provided upstream open-source driver support for the Radeon RX 7900 series launch, the initial user experience can be less than desirable if running a new Radeon GPU but initially running an out-of-date kernel or lacking the necessary firmware support. With a new patch series posted AMD is looking to improve the experience by being able to more easily fallback to the firmware frame-buffer when their AMDGPU kernel graphics driver fails to properly load.

With the new IP-based discovery "block by block" approach to how the open-source AMD Radeon Linux graphics driver is managing the hardware initialization with RDNA3 and moving forward, the AMDGPU driver will try to probe all Radeon GPUs even if it might not end up being fully supported. In turn that ends up destroying the system firmware frame-buffer. But right now in the case of booting an RDNA3 GPU with a slightly out of date kernel (pre-6.0) or lacking the necessary RDNA3 firmware for hardware initialization, it can mean the screen freezing or system appearing unresponsive.

Tesla has launched Steam integration inside its Model S and Model X electric cars with thousands of games now playable. Electrek reports: Today, Tesla launched Steam Beta for Model S and Model X as part of its "holiday update." We reported all the details of Tesla's holiday update earlier today for most Tesla vehicles, but the Steam integration is only for the refreshed Model S and Model X produced over the last two years. That's because Tesla's two flagship vehicles are equipped with a more powerful entertainment computer designed for video games.

With the unveiling of the new Model S and Model X, Tesla announced the new gaming computer: "Up to 10 teraflops of processing power enables in-car gaming on-par with today's newest consoles via Tesla Arcade. Wireless controller compatibility allows gaming from any seat." A known chip leaker, Patrick Schur, posted a diagram of Tesla's new gaming computer powered by the AMD Navi 23 GPU. The system is integrated and connects directly to two touchscreens inside the Model S and Model X to play games, watch entertainment, and perform other functions. Musk also revealed that the new computer has more storage space to be able to handle more games on the platform at the same time, which is going to be useful to handle your Steam library. The holiday update also brings support for Apple Music, an update to Dog Mode, improvements to Tesla's "Light Show" feature, and a bunch of smaller features/updates.

"Linus has released the 6.1 kernel," reports LWN.net — and it's the one with initial support for kernel development in Rust.

Elsewhere LWN explains the specifics of this milestone: No system with a production 6.1 kernel will be running any Rust code, but this change does give kernel developers a chance to play with the language in the kernel context and get a sense for how Rust development feels....

There are other initiatives underway, including the writing of an Apple graphics driver in the Rust language. For the initial merge into the mainline kernel, though, Linus Torvalds made it clear that as little functionality as possible should be included. So those drivers and their support code were trimmed out and must wait for a future kernel release. What is there is the support needed to build a module that can be loaded into the kernel, along with a small sample module.... Torvalds asked for something that could do "hello world" and that is what we got. It is something that can be played with, but it cannot be used for any sort of real kernel programming at this point.

That situation will, hopefully, change in the near future.
Meanwhile, Linux 6.1 also includes "support for destructive BPF programs, some significant io_uring performance improvements, better user-space control over transparent huge-page creation, improved memory-tiering support."

The Register adds: Other interesting additions include more support for the made-in-China LoongArch CPU architecture, introductory work to support Wi-Fi 7 and security fixes for some flaky Wi-Fi routines in previous versions of the kernel. There's also plenty of effort to improve the performance of Linux on laptops, and enhanced power efficiency for AMD's PC-centric RYZEN silicon.

Chipmaker AMD has hinted that new transistor technology will keep Moore's Law alive for the next six to eight years, but as one might guess, it will cost more. From a report: Meanwhile, the company still plans to market new chips based on its Zen 4 architecture next year, including Bergamo, which is intended to compete against Arm-based chips for cloud-native computing. In an interview with Wells Fargo analyst Aaron Rakers at the financial outfit's TMT Summit, AMD CTO Mark Papermaster talked about future directions and the company's near-term roadmap. Rakers asked about the Zen family and its chiplet-based architecture versus the monolithic architecture seen with Intel's CPUs, and whether this would continue to serve AMD for the next four to five years, or whether another novel approach might be needed.

"Innovation always finds its way around barriers," Papermaster said. "I can see exciting new transistor technology for the next -- as far as you can really plot these things out -- about six to eight years, and it's very, very clear to me the advances that we're going to make to keep improving the transistor technology, but they're more expensive," he said. In the past, chipmakers like AMD and Intel could double the transistor density every 18 to 24 months and stay within the same cost envelope, but that is not the case anymore, Papermaster claimed. "So, we're going to have innovations in transistor technology. We're going to have more density. We're going to have lower power, but it's going to cost more. So how you put solutions together has to change," he said.

An anonymous reader shares a report: Nvidia's new RTX 4090 and 4080 GPUs both use a new connector called 12VHPWR to deliver power as a way to satisfy ever-more power-hungry graphics cards without needing to set aside the physical space required for three or four 8-pin power connectors. But that power connector and its specifications weren't created by Nvidia alone -- to ensure interoperability, the spec was developed jointly by the PCI Express Special Interest Group (PCI-SIG), a body that includes Nvidia, AMD, Intel, Arm, IBM, Qualcomm, and others.

But the overheating and melting issues experienced by some RTX 4090 owners recently have apparently prompted the PCI-SIG to clarify exactly which parts of the spec it is and is not responsible for. In a statement reported by Tom's Hardware, the group sent its members a reminder that they, not the PCI-SIG, were responsible for safety testing products using connector specs like 12VHPWR. "Members are reminded that PCI-SIG specifications provide necessary technical information for interoperability and do not attempt to address proper design, manufacturing methods, materials, safety testing, safety tolerances, or workmanship," the statement reads. "When implementing a PCI-SIG specification, Members are responsible for the design, manufacturing, and testing, including safety testing, of their products."

The head of Intel's revitalized contract chip manufacturing business plans to step down, The Register has learned, creating a setback for the x86 behemoth's big bet to take on Asian foundry giants TSMC and Samsung as part of its comeback plan. From the report: Randhir Thakur, senior vice president and president of Intel Foundry Services, "has decided to pursue other opportunities" but will continue to lead the business unit through the first quarter of 2023 to "ensure a smooth transition to a new leader," Intel CEO Pat Gelsinger said in an email to employees Monday that was seen by el Reg. Intel spokesperson William Moss confirmed the news with us. "We're grateful to Randhir for the tremendous progress IFS has made and for laying the foundation for Intel to become a world-class systems foundry," Moss said in a statement. "We wish him all the best in his new endeavors."

In his email, Gelsinger said he will share more information soon "about the new leader" for Intel Foundry Services, suggesting the company may have a successor in place -- or is at least close to having one. "Randhir has been a key member of the Executive Leadership Team for the past two and a half years and has served in several senior leadership roles since he joined us in 2017," Gelsinger wrote. "... His contributions to our [Integrated Device Manufacturing] 2.0 transformation are many, but most notable is his leadership in standing up our IFS business."

Intel revitalized its contract chip manufacturing business in early 2021 and renamed it Intel Foundry Services with the goal of competing with TSMC and Samsung, the world's two largest contract chip manufacturers that make chips for the likes of Intel rivals, including AMD, Nvidia, and Apple. In his email to employees, Gelsinger credited Thakur for establishing a "seasoned leadership team with veterans from leading foundries" like TSMC and Samsung. He added that the Intel Foundry Services leader also "secured major customer wins in the mobile and auto segments" and helped the company win the US government's RAMP-C award along with four customers for chip designs on its 18A node. "Since Q2, IFS has expanded engagements to seven of the 10 largest foundry customers coupled with consistent pipeline growth to include 35 customer test chips," Gelsinger said. "This is tremendous progress in only 20 months!" Intel has a pending $5.4 billion acquisition of Israeli chip manufacturer Tower Semiconductor, notes The Register. "Analysts responding to the news of Thakur's resignation said the move is likely happening because Intel plans to put Tower Semiconductor's management in charge of Intel Foundry Services." The deal is expected to close in the first quarter of 2023.

Michael Larabel, reporting for Phoronix: This summer AMD announced the Radeon Raytracing Analyzer "RRA" as part of their developer software suite for helping to profile ray-tracing performance/issues on Windows and Linux with both Direct3D 12 and the Vulkan API. Initially the RRA 1.0 release was binary-only but now AMD has made good on their "GPUOpen" approach and made it open-source.

As noted back in my original article from July on the Radeon Raytracing Analyzer release: "Radeon Raytracing Analyzer is hosted on GitHub but the only content in the actual Git repository right now is documentation, so it would appear that at least initially this is a closed-source package though some documentation also says it's MIT licensed."

Last week that was cleared up with the Radeon Raytracing Analyzer source code going public. There are build instructions for compiling the RRA 1.0 sources on both Microsoft Windows and Linux while the Linux instructions are tailoring to Ubuntu use. Building the Radeon Raytracing Analyzer depends upon the Qt 5.15 toolkit.

Intel's latest plan to ward off rivals from high-performance computing workloads involves a CPU with large stacks of high-bandwidth memory and new kinds of accelerators, plus its long-awaited datacenter GPU that will go head-to-head against Nvidia's most powerful chips. From a report: After multiple delays, the x86 giant on Wednesday formally introduced the new Xeon CPU family formerly known as Sapphire Rapids HBM and its new datacenter GPU better known as Ponte Vecchio. Now you will know them as the Intel Xeon CPU Max Series and the Intel Data Center GPU Max Series, respectively, which were among the bevy of details shared by Intel today, including performance comparisons. These chips, set to arrive in early 2023 alongside the vanilla 4th generation Xeon Scalable CPUs, have been a source of curiosity within the HPC community for years because they will power the US Department of Energy's long-delayed Aurora supercomputer, which is expected to become the country's second exascale supercomputer and, consequently, one of the world's fastest.

In a briefing with journalists, Jeff McVeigh, the head of Intel's Super Compute Group, said the Max name represents the company's desire to maximize the bandwidth, compute and other capabilities for a wide range of HPC applications, whose primary users include governments, research labs, and corporations. McVeigh did admit that Intel has fumbled in how long it took the company to commercialize these chips, but he tried to spin the blunders into a higher purpose. "We're always going to be pushing the envelope. Sometimes that causes us to maybe not achieve it, but we're doing that in service of helping our developers, helping the ecosystem to help solve [the world's] biggest challenges," he said. [...] The Xeon Max Series will pack up to 56 performance cores, which are based on the same Golden Cove microarchitecture features as Intel's 12th-Gen Core CPUs, which debuted last year. Like the vanilla Sapphire Rapids chips coming next year, these chips will support DDR5, PCIe 5.0 and Compute Express Link (CXL) 1.1, which will enable memory to be directly attached to the CPU over PCIe 5.0.

Cutting-edge semiconductor companies tweak specs to comply with export controls. From a report: Alibaba and start-up Biren Technology are tweaking their most advanced chip designs to reduce processing speeds and avoid US-imposed sanctions aimed at suppressing Chinese computing power. Alibaba, Biren, and other Chinese design houses have spent years and millions of dollars creating the blueprints for advanced processors to power the country's next generation of supercomputers, artificial intelligence algorithms and data centers. These are produced offshore by the world's biggest contract chipmaker, Taiwan Semiconductor Manufacturing. But sanctions announced by Washington last month that cap the processing power of any semiconductor shipped into China without a license have thrown a wrench into their ambitions.

Both Alibaba and Biren had already conducted expensive test runs of their latest chips at TSMC when Washington unveiled the controls. The rules have forced the companies to halt further production and make changes to their designs, according to six people briefed on the situation. They mark another blow for Alibaba, the tech group founded by billionaire Jack Ma. Its shares have lost 80 percent of their value since Beijing canceled sister group Ant's initial public offering two years ago. The group's new chip was to be its first graphics processing unit and was close to being unveiled, according to three people close to the matter. The US export controls extend to third-country chip manufacturers because almost all semiconductor fabrication plants use American components or software, meaning the rules may amount to an embargo on all high-end processors entering China. Washington earlier restricted such imports from California chip companies Nvidia and AMD.

Slashdot readers MojoKid and williamyf share the news of AMD's two new high-end graphics cards, the Radeon RX 7900 XTX and 7900 XT. "Priced at $999 and $899 respectively and available in December this year, the new Radeon cards are expected to go toe-to-toe with NVIDIA's GeForce RTX 4080 and 4090," writes MojoKid. HotHardware reports: AMD states that its goals for RDNA 3 are to accelerate performance-per-watt leadership and to raise the bar for high resolution and high framerate gaming. AMD has turned to a chiplet architecture to accomplish these goals, a first for gaming GPUs. The chiplet complexes consist of a 5nm graphics compute die (GCD), which is flanked top and bottom by up to six 6nm memory and cache dice (MCD). The RX 7900 XTX uses the full complement of 6 MCDs which aggregates as a 384-bit memory bus (64-bit per die) with GDDR6 memory offering 20Gbps of throughput. The RX 7900 XT uses 5 MCDs with a corresponding 320-bit bus.

All of this increased bandwidth and resources translates to what AMD claims is up to a 1.7X uplift in performance for the Radeon RX 7900 XTX versus its previous gen Radeon RX 6950 XT card in high resolution gaming. This could put the card within striking distance of NVIDIA's GeForce RTX 4090 possibly, but it's hard to say until cards ship to independent reviewers for testing. Regardless, gamers will appreciate the RX 7900 XTX's price point versus NVIDIA's $1600 top-end beast.

It has been almost three years since Chromebook users got word that Steam support is coming to ChromeOS. We're still not totally there yet, but today Google announced that it's ready to enter beta testing. From a report: In a blog post, Zach Alcorn, Google product manager, announced that Steam on Chromebooks is available as a beta with ChromeOS 108.0.5359.24 and later. Steam on ChromeOS entered alpha in March, and Alcorn said the updates announced today are based on "thousands of gameplay reports." The Steam on ChromeOS alpha required not just an Intel CPU, but also an Intel 11th-gen Core i5 chip with Intel's Iris Xe graphics. The beta supports Intel's latest 12th-gen chips and extends support to Team Red. Alcorn said the beta supports AMD's Ryzen 5000 C-Series CPUs.

Fierce Electronics reports on "a complex legal battle in U.S. district court" between Qualcomm and Arm "over licensing of intellectual property with potentially far-reaching impact..." Normally, Arm licenses its architectural designs and related IP to chipmakers such as Nvidia or Qualcomm, which in turn produce chips that are then sold to OEMs that use those chips to make servers and other computers and devices. In an updated Qualcomm counterclaim made public Oct. 26, Qualcomm argues that Arm is no longer going to license its CPU designs after 2024 to Qualcomm and other chip companies under technology license agreements. Instead, Qualcomm asserts, Arm will only license to a broad array of device makers....

Arm has not yet formally responded to Qualcomm's latest counterclaim but told Fierce Electronics via email on Friday that Qualcomm's complaint is "riddled with inaccuracies" that Arm will address in a formal legal response in coming weeks....

[Analyst] Dylan Patel in SemiAnalysis also said the counterclaim shows Arm is not planning to allow external GPUs, NPUs or ISPs in Arm-based SoCs. "It seems that Arm is effectively bundling its other IP with the CPU IP in a take-it-or-leave-it model," Patel said. "That would mean Samsung's licensing deal with AMD for GPU or Mediatek with Imagination GPU is not longer allowed after 2024...." Qualcomm argues Arm is making it clear to the marketplace that "it will act recklessly and opportunistically, threatening the development of new and innovative products as a negotiating tactic, not because it has valid license and trademark claims."
Again, Arm has called Qualcomm's complaint "riddled with inaccuracies." Jack Gold, an analyst at J. Gold Associates, tells Fierce Wireless that If Qualcomm's counterclaim is accurate, "this is a troubling step for the industry." If Arm were to get rid of tech licensing as described by Qualcomm, it would give rise to RISC-V use, something Arm "should be worried about," Gold said....

[Analyst] Patel has also questioned if Arm's original lawsuit is more than just about money and might be because Softbank (owner of Arm) and Arm remain angry that Qualcomm, as Patel puts it, worked with regulators to block Nvidia's $40 billion acquisition of Arm. After working for more than a year to seal the deal, Nvidia and SoftBank announced the termination of the proposed deal on Feb. 7, 2022, due to "significant regulatory challenges." Arm was expected to go public within a year, but an IPO has not occurred as of late October.

An anonymous reader quotes a report from The Register: AMD turned to advanced packaging to create chiplet designs and become a formidable CPU player again. Apple used the tech to beef up the power of its M1 Ultra chip. And Intel is pinning its future success on 2D and 3D multi-die packaging technologies as part of its ambitious comeback plan. Now TSMC, the world's largest contract chipmaker, wants to make chiplet-based products easier and faster to manufacture using its growing toolbox of advanced packaging tech that has already benefited the likes of AMD, Apple, and others. The Taiwanese foundry giant plans to do this through the formation of the 3DFabric Alliance, announced Thursday, which aims to help chip designers implement advanced packaging tech into their plans faster by collaborating with partner companies that are key to the development process.

TSMC's partners cover several important elements of chip development, from electronic design automation and memory to substrates and testing. As part of the new alliance, they will have early access to TSMC's 3DFabric portfolio of 3D silicon stacking and advanced packaging technologies. The goal is to allow these partners to build new solutions in parallel with the development of TSMC's 3DFabric tech so that chip designers can get their hands on the tools, technologies, materials, and other resources necessary to make multi-die chip packages faster. TSMC's 3DFabric portfolio includes brand-new technology, like system-on-integrated-chips (SoIC), which underpins the 3D V-Cache tech in AMD's Milan-X and Ryzen 7 5800X3D processors that came out this year. The portfolio also includes older technologies: integrated-fan-out and chip-on-wafer-on-substrate (CoWoS), which have received new iterations over the past several years. Those using CoWoS include Nvidia and Amazon Web Services. Representatives from AMD, Nvidia, and AWS gave support for the new alliance, which is one of several set up by TSMC as part of its Open Innovation Platform initiative. TSMC veep of R&D, LC Lu, said while advanced packaging technologies can "open the door to a new era of chip-level and system-level innovation," "extensive ecosystem collaboration" is required to "help designers navigate the best path through the myriad options and approaches available to them."

"Through the collective leadership of TSMC and our ecosystem partners, our 3DFabric Alliance offers customers an easy and flexible way to unlocking the power of 3D [integrated circuits] in their designs," he added.