
Intel Skylake CPUs Are Warping Under Mounting Pressure From Third-Party Coolers (hothardware.com) 115
MojoKid writes: It's been discovered that some third-party heat sinks can physically damage Intel's new Skylake CPUs, along with the pins in the accompanying motherboard socket. The problem has prompted at least one cooler maker to change the design of its Socket 1151 heat sinks and it wouldn't be surprising if others soon followed suit. The apparent issue is the substrate Intel used for its Skylake chips. A close-up shot of a Skylake CPU sitting side-by-side with a Broadwell processor (Google translation of German original) shows that the substrate is noticeably thinner on Skylake, and thus prone to bending from the force that some third-party heat sinks exert.
Intel has addressed the issue by saying, “The design specifications and guidelines for the 6th Gen Intel Core processor using the LGA 1151 socket are unchanged from previous generations and are available for partners and 3rd party manufacturers. Intel can’t comment on 3rd party designs or their adherence to the recommended design specifications. For questions about a specific cooling product we must defer to the manufacturer.”